Integrated circuit protruding pad package system

Details Integrated circuit protruding pad package system Integrated circuit protruding pad package system

2011-06-28

2011-06-28

Im, Junghwa M (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S111000, C438S123000, C438S125000, C438S126000, C438S108000, C438S612000, C257S678000, C257SE21504

Reexamination Certificate

active

07968377

ABSTRACT:
An integrated circuit package system is provided. A protruding pad is formed on a leadframe. A die is attached to the leadframe. The die is electrically connected to the leadframe. At least portions of the leadframe, the protruding pad, and the die are encapsulated in an encapsulant.

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