Integrated circuit package system with die and package...

Details Integrated circuit package system with die and package... Integrated circuit package system with die and package...

2005-11-22

2009-10-06

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23085, C257SE23052, C257SE23046, C257SE23126, C257SE23114, C257S787000, C257S723000, C257S685000, C257S777000, C257S666000, C438S109000, C438S124000

Reexamination Certificate

active

07598606

ABSTRACT:
An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit.

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