Min-Liang Chen

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CMOS integrated circuit having improved isolation

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Completely removal of TiN residue on dual damascence process

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Contact metallization of semiconductor integrated-circuit device

Fishing – trapping – and vermin destroying
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Double-poly monos flash EEPROM cell

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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High density memory structure

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Profile ID: LFUS-PAI-P-335192

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