4. Adhesive bonding and miscellaneous chemical manufacture
  5. Surface bonding means and/or assembly means therefor
  6. With cutting, punching, piercing, severing, or tearing

Min-Il Kim

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Apparatus for bonding a chip using an insulating adhesive tape

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Reexamination Certificate

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Semiconductor chip package having an adhesive tape attached...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Semiconductor chip package having an adhesive tape attached...

Electricity: conductors and insulators – Boxes and housings – With electrical device
Reexamination Certificate

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Semiconductor chip package having an adhesive tape attached...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2978314

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