Semiconductor chip package having an adhesive tape attached...

Details Semiconductor chip package having an adhesive tape attached... Semiconductor chip package having an adhesive tape attached...

2006-02-28

2006-02-28

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S050510, C257S738000, C257S783000

Reexamination Certificate

active

07005577

ABSTRACT:
The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the active surface of the semiconductor chips for encapsulating at least an upper portion of the bonding wires adjacent the active surfaces to improve the stability of the bonding wires during subsequent processing.

REFERENCES:
patent: 5323060 (1994-06-01), Fogal et al.
patent: 6316727 (2001-11-01), Liu
patent: 6333562 (2001-12-01), Lin
patent: 6388313 (2002-05-01), Lee et al.
patent: 6414384 (2002-07-01), Lo et al.
patent: 6545365 (2003-04-01), Kondo et al.
patent: 6569709 (2003-05-01), Derderian
patent: 6650019 (2003-11-01), Glenn et al.
patent: 2000-003001 (2000-01-01), None
patent: 2000-058742 (2000-10-01), None

Affiliated with

Also associated with

Rating

Semiconductor chip package having an adhesive tape attached... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip package having an adhesive tape attached..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip package having an adhesive tape attached... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3656384