Apparatus for bonding a chip using an insulating adhesive tape

Details Apparatus for bonding a chip using an insulating adhesive tape Apparatus for bonding a chip using an insulating adhesive tape

2006-08-29

2006-08-29

Gray, Linda (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With cutting, punching, piercing, severing, or tearing

C156S559000, C156S566000, C156S264000, C438S118000, C029S025010, C029S738000, C029S742000, C029S759000

Reexamination Certificate

active

07096914

ABSTRACT:
In an embodiment of the invention an apparatus is configured to stack a plurality of semiconductor chips having the same or similar size. The apparatus includes a tape providing unit for providing an insulating adhesive tape, a tape attaching device for attaching the insulating adhesive tape to an area between electrode pads of a first chip, and a chip attaching device for attaching a second chip to the insulating adhesive tape.

REFERENCES:
patent: 5431767 (1995-07-01), Koza et al.
patent: 6742561 (2004-06-01), Nam et al.
patent: 2001/0005953 (2001-07-01), Tandy
patent: 2004/0108582 (2004-06-01), Kim et al.
patent: 04-365337 (1992-12-01), None
patent: 1020000014967 (2000-03-01), None
English Abstract of Korean Publication No. 1020000014967.
English Abstract of Japanese Publication No. 04-365337.

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