Semiconductor chip package having an adhesive tape attached...

Details Semiconductor chip package having an adhesive tape attached... Semiconductor chip package having an adhesive tape attached...

2007-06-05

2007-06-05

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C174S535000, C174S558000, C257S777000, C257S783000

Reexamination Certificate

active

11324293

ABSTRACT:
The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the active surface of the semiconductor chips for encapsulating at least an upper portion of the bonding wires adjacent the active surfaces to improve the stability of the bonding wires during subsequent processing.

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patent: 2000-058742 (2000-02-01), None
patent: 2000-0003001 (2000-01-01), None

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