Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-03-26
2008-08-12
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C257SE21499
Reexamination Certificate
active
07410832
ABSTRACT:
The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the active surface of the semiconductor chips for encapsulating at least an upper portion of the bonding wires adjacent the active surfaces to improve the stability of the bonding wires during subsequent processing.
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Kim Min-Il
Lee Sang-Yeop
Geyer Scott B.
Harness & Dickey & Pierce P.L.C.
Samsung Electronics Co,. Ltd.
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