4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Miles Frank Swain

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Column grid array or ball grid array pad on via

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Column grid array or ball grid array pad on via

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Electrical connector system with connector retainer

Electrical connectors – With coupling movement-actuating means or retaining means in... – Retaining means
Patent

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High performance pad on pad connector for flex circuit packaging

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent

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Tool for removing protective encapsulants

Cleaning and liquid contact with solids – Processes – Including melting
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Profile ID: LFUS-PAI-P-359431

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