Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-01-08
2000-02-15
Stephan, Steven L.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439493, H01R 909
Patent
active
060245808
ABSTRACT:
A flex cable pad on pad terminal structure is shown having raised connector pads formed using a rigid stiffener with raised features or bumps formed integral with the stiffener; aligned with the connector pad surfaces; and laminated to the flex cable surface opposite the surface presenting the exposed connector pad surfaces, to create raised contact pads that are not subject to relaxation over time when subjected to high contact normal forces. The use of a metal stiffener which has been coined to produce the raised features aligned with the contact pad locations and lamination using a film or layer of thermocuring adhesive affords an economical process and assembly technique that also effects hot deformation of the flex cable at the contact pad locations.
REFERENCES:
patent: 3114587 (1963-12-01), Herrmann
patent: 4116517 (1978-09-01), Selvin et al.
patent: 4871315 (1989-10-01), Noschese
patent: 4911653 (1990-03-01), Walton et al.
patent: 5147208 (1992-09-01), Bachler
patent: 5372512 (1994-12-01), Wilson et al.
Dangler John Richard
Hoffmeyer Mark Kenneth
Kidd Thomas Donald
Swain Miles Frank
Bussan Matthew J.
International Business Machines - Corporation
Lahtinen Robert W.
Patel T C
Stephan Steven L.
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