Tool for removing protective encapsulants

Cleaning and liquid contact with solids – Processes – Including melting

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Details

134198, 134108, 134902, 134 10, 134 34, B08B 302

Patent

active

058912576

ABSTRACT:
A system for removing protective coatings from a circuit board assembly. The system includes a tool for removing protective coatings from a circuit board assembly. The tool has a flow head, which includes a support, having an opening which is adapted to contact the circuit board assembly and flow solvent to the surface of the circuit board. The flow head may also include a solvent nozzle positioned within the support. The solvent nozzle has an opening adapted to apply solvent to the circuit board assembly. The flow head also includes a solvent recovery volume positioned beneath the support and adjacent to the nozzle. The system also includes a second solvent reservoir, a mechanism for applying heat to the reservoir, and a mechanism for circulating solvent from the reservoir to the flow head and back to the reservoir.

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Lee, Henry et al., Handbook of Epoxy Resins, (1967), pp. 12-2-13-1.

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