4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Encapsulating

Mikio Baba

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Multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Multi-chip module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Semiconductor device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Semiconductor device assembly method and semiconductor device pr

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent

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Semiconductor device mounting structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Profile ID: LFUS-PAI-P-583706

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