Multi-chip module

Details Multi-chip module Multi-chip module

1996-09-16

1998-05-12

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257685, 257686, 257706, 257712, 361719, 361720, 361736, 361784, H01L 2334, H01L 2302, H01L 2310

Patent

active

057510636

ABSTRACT:
Disclosed is a multi-chip module. According to the present invention, the multi-chip module comprises: a first insulating board having a first surface and a second surface that is positioned opposite to the first surface; at least one semiconductor chip mounted on the first surface of the first insulating board; a plurality of metal connection members arranged on the second surface of the first insulating board; a second insulating board that is connected to the plurality of metal connection members; a metal plate that is securely attached to one part of the second surface of the first insulating board through an opening in the second insulating board; and electric components mounted on a surface of the second insulating board.

REFERENCES:
patent: 5222014 (1993-06-01), Lin
patent: 5237204 (1993-08-01), Val
patent: 5444296 (1995-08-01), Kaul et al.
patent: 5543663 (1996-08-01), Takubo
patent: 5567983 (1996-10-01), Hirano et al.
patent: 5633783 (1997-05-01), Yamamoto

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