Semiconductor device mounting structure

Details Semiconductor device mounting structure Semiconductor device mounting structure

1997-08-20

2000-01-18

Martin-Wallace, Valencia

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257783, 257738, 22818022, H01L 2348, H01L 2352, H01L 2940

Patent

active

060160136

ABSTRACT:
Insulating resin layers are formed respectively so as to cover electrical pads for the purpose of connecting metal bumps of a semiconductor device and a mounting board, metal bump electrode pads being formed on the surface of these insulating resin layers, so that the electrode pads are electrically connected to one another. Thermal stress between the semiconductor device and the mounting board is absorbed by the insulating resin layers, the influence felt on the metal bumps being alleviated, thereby achieving an improvement in the reliability of the connection made by the metal bumps.

REFERENCES:
patent: 4336551 (1982-06-01), Fujita et al.
patent: 4764804 (1988-08-01), Sahara et al.
patent: 4887760 (1989-12-01), Yoshimo et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5534465 (1996-07-01), Frye et al.
patent: 5600180 (1997-02-01), Kusaka et al.
patent: 5757078 (1998-05-01), Matsuda et al.
"Past: Why MCM is needed?" (Original source and issue date unknown).

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