Multi-chip module

Details Multi-chip module Multi-chip module

1996-07-08

1998-04-21

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257686, 257713, 361690, 361715, 361735, H05K 720

Patent

active

057424772

ABSTRACT:
A multi-chip module includes an insulating board, a semiconductor chip, a plurality of carriers, and semiconductor devices. The insulating board has a recess portion formed in a central portion of a lower surface. A wiring pattern is formed on the insulating board. The semiconductor chip is mounted in the recess portion in the insulating board. Each carrier is mounted on the upper surface of the insulating board and has a leg portion with a side-surface electrode formed on a side surface. The resin-sealed semiconductor devices are respectively mounted on the carriers. The resin-sealed semiconductor devices are mounted in a stacked state.

REFERENCES:
patent: 5065277 (1991-11-01), Davidson
patent: 5567983 (1996-10-01), Hirano et al.
patent: 5589711 (1996-12-01), Sano et al.

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