Semiconductor device assembly method and semiconductor device pr

Details Semiconductor device assembly method and semiconductor device pr Semiconductor device assembly method and semiconductor device pr

1998-12-30

2000-04-04

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

438108, 438118, 438121, 438122, 438124, 438125, 438126, H01L 2144, H01L 2148, H01L 2150

Patent

active

060460776

ABSTRACT:
A method of assembling a semiconductor device dissipates the stress of hardening an underfill resin injected between the wiring board and a semiconductor chip mounted on the wiring board. The underfill resin and a sealing member bonding resin are simultaneously hardened. Alternatively, a sealing space sealed by the sealing member is filled with the underfill resin.

REFERENCES:
patent: 5811317 (1998-09-01), Maheshwari et al.
patent: 5930597 (1999-07-01), Call et al.

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