4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

Matthew K. Schwiebert

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High-frequency electronic package with arbitrarily-shaped interc

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Impedance matching external component connections with...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Integral insert molded fiber optic transceiver...

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate

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Method of bumping substrates by contained paste deposition

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Method of bumping substrates by contained paste deposition

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Profile ID: LFUS-PAI-P-931989

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