Method of bumping substrates by contained paste deposition

Details Method of bumping substrates by contained paste deposition Method of bumping substrates by contained paste deposition

1994-08-08

1996-07-23

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174259, 29832, 2281801, H05K 118

Patent

active

055391532

ABSTRACT:
A solder bump is stenciled into a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls

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