Impedance matching external component connections with...

Details Impedance matching external component connections with... Impedance matching external component connections with...

2005-03-10

2008-12-30

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S763000, C361S772000, C361S785000

Reexamination Certificate

active

07471520

ABSTRACT:
In one aspect, an electronic assembly includes an interconnection substrate, a component, and a discontinuity compensator. The interconnection substrate includes a signal conductor and a ground conductor. The component includes a device having a signal line and a ground conductor, a package, and a signal lead. The signal lead is electrically coupled to an internal signal path of the package and has an external portion extending from the package to the signal conductor of the interconnection substrate. The discontinuity compensator electrically couples a ground path of the package to the ground conductor of the interconnection substrate. The discontinuity compensator includes an electrically conducting planar surface that is oriented in a plane intersecting the interconnection substrate and forms with at least a substantial part of the external portion of the signal lead a transmission line structure having an impedance substantially matching the nominal impedance over the specified bandwidth.

REFERENCES:
patent: 3628105 (1971-12-01), Sakai et al.
patent: 3715635 (1973-02-01), Michel et al.
patent: 4951011 (1990-08-01), Heckman et al.
patent: 5596665 (1997-01-01), Kurashima et al.
patent: 5936492 (1999-08-01), Shingyoji et al.
patent: 6535393 (2003-03-01), Akram et al.
patent: 6707679 (2004-03-01), Yang
patent: 7109523 (2006-09-01), Ishimura
patent: 2003/0223203 (2003-12-01), Lutkiewiez et al.
patent: 2004/0240803 (2004-12-01), Rechberger et al.

Affiliated with

Also associated with

Rating

Impedance matching external component connections with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Impedance matching external component connections with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Impedance matching external component connections with... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4021035