Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-07-31
2000-10-24
Gaffin, Jeffrey
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361768, 361771, 361779, 361816, 361818, 2281801, 22818021, H05K 900, H05K 118
Patent
active
061376930
ABSTRACT:
A surface mountable high frequency electronic package consisting of substrates stacked on top of each other, with arbitrarily-shaped solder structures such as balls and walls connecting them together; forming a fully-shielded, environmentally-sealed, sandwich in which smaller electronic components and devices are placed. In addition to providing electronic and mechanical interconnection to a mother substrate, the solder structures also provide electromagnetic isolation and shielding, controlled-impedance transmission line structures, and an environmental seal. The entire package is fabricated from conventional materials and components assembled together with automated processes.
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Barnett Ron
Chew Geary L.
Hutchison Brian R.
Schwiebert Matthew K.
Agilent Technologie,s Inc.
Gaffin Jeffrey
Vigushin John B.
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