4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

Matthew Heydinger

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Method of bumping substrates by contained paste deposition

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Method of bumping substrates by contained paste deposition

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Method of making solder balls by contained paste deposition

Fishing – trapping – and vermin destroying
Patent

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Method of making solder balls by contained paste deposition

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Passively aligned fiber optical engine for parallel optics...

Optical waveguides – Integrated optical circuit
Reexamination Certificate

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Profile ID: LFUS-PAI-P-931992

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