Method of making solder balls by contained paste deposition

Details Method of making solder balls by contained paste deposition Method of making solder balls by contained paste deposition

1996-03-19

1997-09-30

Picardat, Kevin

Fishing, trapping, and vermin destroying

437187, 437189, 437203, H01L 2144

Patent

active

056725426

ABSTRACT:
A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.

REFERENCES:
patent: 1067415 (1913-07-01), Egner
patent: 3002847 (1961-10-01), Shaffer et al.
patent: 3458925 (1969-08-01), Napier et al.
patent: 3569607 (1971-03-01), Martyak et al.
patent: 3719981 (1973-03-01), Steitz
patent: 4369376 (1983-01-01), Ertl et al.
patent: 4489923 (1984-12-01), Barresi et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4759490 (1988-07-01), Ochiai
patent: 4832255 (1989-05-01), Bickford et al.
patent: 4898320 (1990-02-01), Dunaway et al.
patent: 4906823 (1990-03-01), Kushima et al.
patent: 5022580 (1991-06-01), Pedder
patent: 5024372 (1991-06-01), Altman et al.
patent: 5046161 (1991-09-01), Takada
patent: 5060027 (1991-10-01), Hart et al.
patent: 5105537 (1992-04-01), Datta et al.
patent: 5108027 (1992-04-01), Warner et al.
patent: 5118027 (1992-06-01), Braun et al.
patent: 5118029 (1992-06-01), Fuse et al.
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5137845 (1992-08-01), Lochon et al.
patent: 5139610 (1992-08-01), Dunaway et al.
patent: 5162257 (1992-11-01), Yung
patent: 5217597 (1993-06-01), Moore et al.
patent: 5219117 (1993-06-01), Lin
patent: 5261593 (1993-11-01), Casson et al.
patent: 5271548 (1993-12-01), Maiwald
patent: 5307983 (1994-05-01), Dudderar et al.
patent: 5317438 (1994-05-01), Suzuki et al.
patent: 5323947 (1994-06-01), Juskey et al.
patent: 5346118 (1994-09-01), Degani et al.
patent: 5397921 (1995-03-01), Karnezos
patent: 5491364 (1996-02-01), Brandenburg et al.
patent: 5508225 (1996-04-01), Baker
patent: 5525838 (1996-06-01), Kaneko
patent: 5547530 (1996-08-01), Nakamura et al.
"Metal Mask Solder Transfer Technique", International Interconnection Flip Chip Technology Impact Report, Jun. 1992, Chapter 5, pp. 37-38.

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