Metal fusion bonding – Process – Preplacing solid filler
Patent
1996-03-19
1996-12-24
Heinrich, Samuel M.
Metal fusion bonding
Process
Preplacing solid filler
437183, 164129, 164137, H01L 2160, H05K 334
Patent
active
055867154
ABSTRACT:
A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.
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Campbell Donald T.
Heydinger Matthew
Kraft Robert E.
Schwiebert Matthew K.
Vander Plas Hubert A.
Heinrich Samuel M.
Hewlett--Packard Company
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