4. Stock material or miscellaneous articles
  5. All metal or with adjacent metals
  6. Foil or filament smaller than 6 mils

Masato Takami

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Copper foil for printed circuit board

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent

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Copper foil for printed circuit boards

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent

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Copper foil for printed circuits and method of producing same

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly single metal or alloy substrate of...
Patent

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Copper foil for printed circuits and method of producing same

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent

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Copper foil for printed-wiring board

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-49329

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