Copper foil for printed circuit boards

Details Copper foil for printed circuit boards Copper foil for printed circuit boards

1993-02-02

1994-04-19

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

428675, 428935, B32B 1520

Patent

active

053044282

ABSTRACT:
A method of surface treatment of a copper foil for printed circuit boards comprising the steps of forming a treating layer of copper-zinc or copper-zinc-nickel by electrolysing at least a side of a copper foil in a manner of cathodic electrolysis in a bath of copper-zinc including copper ion, zinc ion, tartaric acid and alkali or further including nickel ion, and giving a chromate treatment to the copper foil. A copper foil for printed circuit boards obtained by using a copper-zinc-nickel bath.

REFERENCES:
patent: 3857681 (1974-12-01), Yates et al.
patent: 4049481 (1977-09-01), Morisaki
patent: 4386139 (1983-05-01), Nakatsugawa
patent: 4857387 (1989-08-01), Eberhardt et al.
patent: 5019222 (1991-05-01), Hino et al.

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