Copper foil for printed circuits and method of producing same

Details Copper foil for printed circuits and method of producing same Copper foil for printed circuits and method of producing same

1992-08-04

1994-08-16

Fuller, Benjamin R.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428632, 428624, 428658, 428674, B32B 1520

Patent

active

053386191

ABSTRACT:
A copper foil for printed circuits having a rust-preventive and heat-discoloration resistant coat, comprising a first layer of zinc or an alloy or a compound or a composition including zinc mainly, and a second layer including a silane coupling agent and phosphorus or a phosphorus compound, said second layer being positioned on the first layer. A method of producing a copper foil for printed circuits comprising the steps of treating the shiny side of a copper foil in a manner of cathode electrolysis in an alkaline solution including zinc ions and chrome ions, or providing the shiny side of a copper foil with a thin plating layer of zinc or a zinc alloy, and thereafter applying onto the treated surface of the copper foil a solution including a silane coupling agent and phosphorus or a phosphorus compound.

REFERENCES:
patent: 2418608 (1947-06-01), Thompson et al.
patent: 4082591 (1978-04-01), Morisaki et al.
patent: 5071520 (1991-12-01), Lin et al.

Affiliated with

Also associated with

Rating

Copper foil for printed circuits and method of producing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper foil for printed circuits and method of producing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper foil for printed circuits and method of producing same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-951017