Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent
1984-11-15
1986-10-28
Rutledge, L. Dewayne
Stock material or miscellaneous articles
All metal or with adjacent metals
Foil or filament smaller than 6 mils
428612, 428626, 428675, 174 685, B32B 1508
Patent
active
046198717
ABSTRACT:
A copper foil resistant to acids and heat and yet easy to etch is obtained by forming a cobalt layer containing molybdenum and/or tungsten on the bonding surface thereof. Roughening of the foil surface prior to formation of the layer provides highly peel-resistant bonding of the foil thereat to resin-containing substrates of the type found in typical printed circuit boards. The provision of a chromate layer on the cobalt further improves the adhesion between the copper foil and resin-containing substrates.
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"Copper Foils and Electric Laminates", Chem. Abstracts 101:172572h, Jun. 1984.
"Electrodeposition of Tungsten and Molybdenum with Iron-Group Metals", Zak et al., Chem. Abstracts 92:171466k, 1979.
"Corrosion Testing of a Cobalt-Molybdenum Alloy", Karavaev et al., Chem. Abstracts 93:56707y and 93:56708z, 1977.
Fukuda Metal Foil & Powder Co., Ltd.
Rutledge L. Dewayne
Zimmerman John J.
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