Masao Sekibata

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Electric component part having lead terminals

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Method for bonding an aluminum wire

Metal fusion bonding – Process – Using high frequency vibratory energy
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Multilayer plating method and multilayer plated film

Stock material or miscellaneous articles – All metal or with adjacent metals – Having composition – density – or hardness gradient
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Packaged semiconductor device structure including getter materia

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Plating process for an electronic part

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
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Profile ID: LFUS-PAI-P-436807

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