Plating process for an electronic part

Details Plating process for an electronic part Plating process for an electronic part

1986-08-12

1988-08-23

Kaplan, G. L.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

204 15, 204 371, B23K 3102

Patent

active

047655283

ABSTRACT:
Before Au-plating onto the metallic surface of an electronic part, Ni-plating and then Co-plating are applied to form a primer coating for Au-plating. But in the steps of Ni and Co-platings, hydrogen gas produced during the plating is occluded into a plating layer. On the other hand, when a pellet connected onto an Au-plated metal, an Au-Si alloy is formed, but hydrogen gas in the plating layer remains as voids in the Au-Si alloy during a subsequent heating step of the electronic part, resulting in a serious defect. This invention of a plating method is characterized by annealing after Au-plating of an electronic part to eliminate the residual gas.

REFERENCES:
patent: 4411965 (1983-10-01), Rosegren et al.
Patent Abstracts of Japan, unexamined applications, C Field, vol. 8, No. 46, 65 C 212, Feb. 29, 1984.
Patent Abstracts of Japan, unexamined applications, C Field, vol. 4, No. 69, 66 C 11, May 22, 1980.
Clifford A. Hampel, "The Encyclopedia of Electrochemistry", pp. 708-711, (1964).

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