Multilayer plating method and multilayer plated film

Details Multilayer plating method and multilayer plated film Multilayer plating method and multilayer plated film

1988-09-22

1990-03-20

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having composition, density, or hardness gradient

428665, 428680, 427123, 427290, B32B 1504, B05D 312

Patent

active

049100947

ABSTRACT:
A primary plated film is formed on the surface of underlayer metal. Next, the heating process is performed and diffusion layers of the underlayer metal and primary plated film are formed. A mechanical abrasion is performed to the surface of the primary plated film, thereby exposing the diffusion layers. Thereafter, a secondary plated film is formed on the exposed diffusion layers. With this multilayer plating method, even in the case of the dissimilar metals, a uniform multilayer plated film of a good adhesive property is derived.

REFERENCES:
patent: 3963455 (1976-06-01), Nobel et al.
patent: 4626479 (1986-12-01), Hosoi et al.
patent: 4655884 (1987-04-01), Hills et al.
patent: 4685030 (1987-08-01), Reyes et al.
patent: 4752499 (1988-06-01), Enomoto

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