Method for bonding an aluminum wire

Details Method for bonding an aluminum wire Method for bonding an aluminum wire

1983-09-23

1986-04-08

Ramsey, Kenneth J.

Metal fusion bonding

Process

Using high frequency vibratory energy

228110, 228205, 219 9121, B23K 2010

Patent

active

045807132

ABSTRACT:
A method for bonding an aluminum wire to a minute pad of an electronic circuit by an ultrasonic bonding technique. An anodized aluminum wire having its surface subjected to insulating coating is used. The bonding is effected such that this anodized aluminum wire is pressed against the pad by means of a wedge and, while a load is being thereby applied to the wire, ultrasonic vibrations are caused in the wedge. The alumite is exfoliated from the base material by application of the load and ultrasonic energy to the wire, and this base material and pad are bonded together at this exfoliated portion.

REFERENCES:
patent: 2021477 (1935-11-01), Bohn
patent: 2754456 (1956-07-01), Madelung
patent: 3259558 (1966-07-01), Hagiwara et al.
patent: 3717842 (1973-02-01), Douglas
patent: 3822465 (1974-07-01), Frankort et al.
patent: 4056681 (1977-11-01), Cook
patent: 4279666 (1981-07-01), Micheli
patent: 4373653 (1983-02-01), Salzer et al.
The Formation of Metal Oxide Films Using Gaseous and Solid Electrolytes, Journal of the Electrochemical Society, J. L. Miles and P. H. Smith, vol. 12, p. 1240, Dec. 1963.

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