Packaged semiconductor device structure including getter materia

Details Packaged semiconductor device structure including getter materia Packaged semiconductor device structure including getter materia

1984-06-29

1986-12-16

Larkins, William D.

357 84, 357 74, 357 73, 357 72, H01L 2310, H01L 2304, H01L 2316, H01L 2330

Patent

active

046300953

ABSTRACT:
A packaged semiconductor device structure includes a semiconductor chip with an organic material covering thereon. The semiconductor chip is placed in a package and hermetically sealed with a low melting point glass. The organic covering serve to suppress undesirable influence on the semiconductor chip by .alpha.-rays which may be radiated from the package, and a getter material is placed in the package for decreasing undesirable gases in the package which may be emitted by the organic covering during the sealing process.

REFERENCES:
patent: 2686279 (1954-08-01), Barton
patent: 4427992 (1984-01-01), Ritchie et al.
"Dynamic Memories Racked by Radiation"-Electronics Jun., 1978, pp. 42-43.
"Getter to Prevent Corrosion"-Goldman-IBM Technical Disclosure-vol. 17, No. 10, 3-1975, p. 2879.
"Planar Multilevel Interconnection Technology Employing a Polyimide"-Mukai et al-IEEE Journal of Solid-State Circuits-Aug. 1978, pp. 462-467.

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