4. Semiconductor device manufacturing: process
  5. Including control responsive to sensed condition
  6. Interconnecting plural devices on semiconductor substrate

Mark Shane Peng

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Clocking architecture in stacked and bonded dice

Semiconductor device manufacturing: process – Including control responsive to sensed condition – Interconnecting plural devices on semiconductor substrate
Reexamination Certificate

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Clocking architecture in stacked and bonded dice

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Design techniques for stacking identical memory dies

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Electromagnetic shielding using through-silicon vias

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Electromagnetic shielding using through-silicon vias

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2193550

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