4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Mark Kenneth Hoffmeyer

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Adhesive-less cover on area array bonding site of circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Apparatus and method to test for known good die

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Application of low temperature metallurgical paste to form a bon

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent

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Application of low temperature metallurgical paste to form a bon

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Customizable backer for achieving consistent loading and...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-175712

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