4. Electrolysis: processes, compositions used therein, and methods
  5. Electrolytic coating
  6. Forming nonelectrolytic coating before depositing...

Mark D. Hoinkis

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Integrated circuits with copper metallization for interconnectio

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Forming nonelectrolytic coating before depositing...
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Stress-relief layer for semiconductor applications

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Tungsten-filled deep trenches

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Via density rules

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1823373

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