4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Responsive to non-electrical signal
  6. Physical deformation

Mark A. Michalicek

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Hinged bonding of micromechanical devices

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate

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Hinged bonding of micromechanical devices

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate

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Micromechanical device latching

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate

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Off substrate flip-chip apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2382081

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