Off substrate flip-chip apparatus

Details Off substrate flip-chip apparatus Off substrate flip-chip apparatus

2006-06-27

2006-06-27

Smith, Bradley K. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S414000, C359S291000

Reexamination Certificate

active

07067892

ABSTRACT:
A flip-chip micromechanical device in which one module of a flip-chip device is stabilized in the substrate-free condition to a degree permitting its successful combination with a second module of the flip-chip device without the benefit of a supporting but interfering substrate element. An etch plate header and coupling tethers provide supporting rigidity to the substrate removed module during its manipulation sequence. Locking of the substrate-free module into a manipulation tolerant and manageable, even by hand, cantilevered status is included. Simplified off chip fabrication of MEMS devices in low cost facilities having only basic alignment equipment is supported by the invention.

REFERENCES:
patent: 5994159 (1999-11-01), Aksyuk et al.
patent: 6300156 (2001-10-01), Decker et al.
patent: 6396975 (2002-05-01), Wood et al.
patent: 6396976 (2002-05-01), Little et al.
patent: 6404942 (2002-06-01), Edwards et al.
patent: 6470110 (2002-10-01), Lin
patent: 6600850 (2003-07-01), Fan
patent: 6755982 (2004-06-01), Lin
patent: 6870660 (2005-03-01), DiCarlo
patent: 2001/0040675 (2001-11-01), True et al.
patent: 2002/0021860 (2002-02-01), Ruan et al.
patent: 2002/0168144 (2002-11-01), Chen et al
patent: 2002/0185699 (2002-12-01), Reid
Pister et al., “Microfabricated Hinges”, Sensors and Actuators, 1992, pp. 249-256, vol. A33, Elsevier Sequoia.

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