4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Marc A. Mangrum

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Method for stacking an integrated circuit on another...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Method of packaging a device having a multi-contact...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Method of packaging a semiconductor device and a...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Package level ESD protection and method therefor

Electricity: electrical systems and devices – Safety and protection of systems and devices – High voltage dissipation
Reexamination Certificate

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Stackable molded packages and methods of making the same

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2970733

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