Method of packaging a device having a multi-contact...

Details Method of packaging a device having a multi-contact... Method of packaging a device having a multi-contact...

2006-11-17

2010-10-05

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257SE21499, C174S521000

Reexamination Certificate

active

07807511

ABSTRACT:
Forming a packaged device having a semiconductor device having a first major surface and a second major surface includes forming an encapsulating layer over the second major surface of the semiconductor device and around sides of the semiconductor device and leaving the first major surface of the first semiconductor device exposed. A first insulating layer is formed over the first major surface. A plurality of vias are formed in the first insulating layer. A plurality of contacts are formed to the semiconductor device through the first plurality of vias, wherein each of the plurality of contacts has a surface above the first insulating layer. A supporting layer is formed over the first insulating layer leaving an opening over the first plurality of contacts wherein the opening has a sidewall surrounding the plurality of contacts.

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