4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Lori A. Dunaway

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Chip packaging systems and methods

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Chip packaging systems and methods

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Methods and apparatus for attaching a die to a substrate

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Methods and apparatus for attaching getters to MEMS device...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate

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Methods and apparatus for attaching getters to MEMS device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2379252

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