Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-01-01
2008-01-01
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S125000, C438S107000, C257S704000, C029S740000, C029S741000
Reexamination Certificate
active
10988799
ABSTRACT:
An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more lids therein, automatically securing a lid to the chip carrier assembly within the vacuum chamber, thereby forming a packaged die, and automatically removing the packaged die from the vacuum chamber. Unique vacuum chambers suitable for MEMS packaging are also disclosed.
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Curtis Harlan L.
DCamp Jon B.
Dunaway Lori A.
Glenn Max C.
Honeywell International , Inc.
McDonnell Boehnen & Hulbert & Berghoff LLP
Thai Luan
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