Methods and apparatus for attaching a die to a substrate

Details Methods and apparatus for attaching a die to a substrate Methods and apparatus for attaching a die to a substrate

2006-05-02

2006-05-02

Ngô, Ngân V. (Department: 2818)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S121000, C438S126000, C438S456000

Reexamination Certificate

active

07037805

ABSTRACT:
A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method includes depositing a plurality of contacts of bonding material between the substrate and die, and forming a bond between the die and the housing by applying at least25,000kilograms of force per gram of bonding material to the housing, the contacts, and the die.

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