4. Metal fusion bonding
  5. Process
  6. Plural joints

Lorenzo Valdevit

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Electronic components on trenched substrates and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Electronic components on trenched substrates and method of...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Electronic components on trenched substrates and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Elliptic C4 with optimal orientation for enhanced...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Elliptic C4 with optimal orientation for enhanced...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3242873

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