Electronic components on trenched substrates and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257SE23026, C257SE23144

Reexamination Certificate

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07732894

ABSTRACT:
A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

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patent: 5739186 (1998-04-01), Hayakawa et al.
patent: 6939737 (2005-09-01), Palanisamy
patent: 2002/0027763 (2002-03-01), Schaper
patent: 2002/0071256 (2002-06-01), Figueroa et al.
patent: 2002/0145197 (2002-10-01), Ohta et al.
patent: 2003/0219956 (2003-11-01), Mori et al.
patent: 2004/0021197 (2004-02-01), Oh et al.
patent: 2004/0022038 (2004-02-01), Figueroa et al.
patent: 195 40 814 (1997-05-01), None

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