Electronic components on trenched substrates and method of...

Details Electronic components on trenched substrates and method of... Electronic components on trenched substrates and method of...

2008-04-08

2010-12-21

Wilczewski, Mary (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257SE23026, C257SE23144

Reexamination Certificate

active

07855430

ABSTRACT:
A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

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Chinese Office Action dated Aug. 28, 2009 issued in Application No. 2008100094465.

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