Elliptic C4 with optimal orientation for enhanced...

Details Elliptic C4 with optimal orientation for enhanced... Elliptic C4 with optimal orientation for enhanced...

2010-08-26

2011-11-01

King, Roy (Department: 1733)

Metal fusion bonding

Process

Plural joints

C228S180500, C228S180220, C438S108000, C361S820000

Reexamination Certificate

active

08047421

ABSTRACT:
An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip.

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patent: 6133134 (2000-10-01), Mehr
patent: 6541857 (2003-04-01), Caletka et al.
patent: 6911738 (2005-06-01), Leinbach
patent: 6913948 (2005-07-01), Caletka et al.
Kuo-Ning Chiang et al., Journal or Electronic Packaging, Jun. 2001, vol. 123, pp. 127-131.
Kuo-Ning, Chiang, et al., entitled “A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads”, Journal of Electronic Packaging, Jun. 2001, vol. 123, pp. 127-131.

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