Elliptic C4 with optimal orientation for enhanced...

Details Elliptic C4 with optimal orientation for enhanced... Elliptic C4 with optimal orientation for enhanced...

2007-03-05

2010-11-30

King, Roy (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S180500, C228S180220, C361S820000, C438S108000

Reexamination Certificate

active

07841508

ABSTRACT:
A method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip.

REFERENCES:
patent: 5565385 (1996-10-01), Rostoker et al.
patent: 5875102 (1999-02-01), Barrow
patent: 5917702 (1999-06-01), Barrow
patent: 6133134 (2000-10-01), Mehr
patent: 6541857 (2003-04-01), Caletka et al.
patent: 6911738 (2005-06-01), Leinbach
patent: 6913948 (2005-07-01), Caletka et al.
Kuo-Ning Chiang, et al., entitled “A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads”, Journal of Electronic Packaging, Jun. 2001, vol. 123, pp. 127-131.

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