4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Linda Pei Ee Chua

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Integrated circuit package system stackable devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Integrated circuit package system with adhesive segment spacer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated circuit package system with conformal shielding...

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding – With means to shield device contained in housing or package...
Reexamination Certificate

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Integrated circuit package system with insulator over circuitry

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Integrated circuit package system with interconnect lock

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2177655

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