Integrated circuit package system stackable devices

Details Integrated circuit package system stackable devices Integrated circuit package system stackable devices

2008-06-25

2010-11-09

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S787000, C257SE23031, C257SE23052, C257SE23054, C438S111000, C438S112000, C438S123000

Reexamination Certificate

active

07829984

ABSTRACT:
An integrated circuit package system includes: providing a finger lead having a side with an outward exposed area and an inward exposed area separated by a lead cavity; positioning a chip adjacent the finger lead and connected to the finger lead; and a stack encapsulant encapsulating the chip and the finger lead with the outward exposed area and the inward exposed area of the finger lead substantially exposed.

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patent: 2008/0017972 (2008-01-01), Bauer et al.

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