Integrated circuit package system with adhesive segment spacer

Details Integrated circuit package system with adhesive segment spacer Integrated circuit package system with adhesive segment spacer

2011-08-09

2011-08-09

Stark, Jarrett J (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S723000, C257S787000, C257S685000, C257SE21164, C257SE25013

Reexamination Certificate

active

07994624

ABSTRACT:
An integrated circuit package system includes attaching an adhesive segment spacer to an interposer assembly; mounting an integrated circuit over a carrier; mounting the interposer assembly over the integrated circuit with the adhesive segment spacer exposing an inner region of the integrated circuit and covering a periphery of the integrated circuit; and forming an encapsulation over the integrated circuit, the interposer assembly, and the adhesive segment spacer with the interposer assembly exposed with a recess in the encapsulation.

REFERENCES:
patent: 6531784 (2003-03-01), Shim et al.
patent: 7023096 (2006-04-01), Lee et al.
patent: 7037756 (2006-05-01), Jiang et al.
patent: 7276790 (2007-10-01), Seng
patent: 7298032 (2007-11-01), Kim et al.
patent: 2007/0296086 (2007-12-01), Ju et al.
patent: 2008/0042251 (2008-02-01), Weng et al.
patent: 2009/0001612 (2009-01-01), Song et al.

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